From concept to commissioning.
A complete engineering partnership for modern, AI-ready data centres — bringing power, cooling, compute, networking and performance together through one coordinated engineering approach.
- 08
- Engineering disciplines
- 100kW+
- Rack density engineered
- <1.15
- PUE design target
- L1–L5
- Commissioning scope
Eight disciplines. One coordinated approach.
Power, cooling, compute, networking and performance, engineered together.
Data Centre Design & Development
From initial planning through design development and execution support.
- Site feasibility
- Master planning
- Retrofit
- Core specialisation
AI Data Centre & GPU Infrastructure
Specialised infrastructure for AI training, inference and GPU-intensive workloads.
- GPU cluster sizing
- Rack architecture
- HGX / DGX
Electrical Infrastructure & Power Efficiency
Power availability and distribution for high-density AI facilities.
- Switchgear
- UPS
- Busway
- Thermal dynamics
Liquid Cooling & Thermal Engineering
A core area of our AI infrastructure offering.
- Direct-to-chip
- CDUs
- CFD
GPU Utilisation & AI Performance Engineering
Useful computing output depends on more than installed hardware.
- Workload profiling
- Inference throughput
- Optimisation
Networking, Storage & AI Cluster Architecture
Networks and storage sized for the intended workloads.
- Ethernet
- InfiniBand
- Optical cabling
Software Infrastructure, Monitoring & Operations
Infrastructure software that keeps AI facilities manageable.
- Kubernetes
- Telemetry
- DCIM
Standards, Compliance & Engineering Assurance
A project-specific engineering framework.
- ASHRAE
- ISO/IEC
- OCP
Discipline Deep-Dive
Examine specific engineering scopes and authoritative deliverables across our eight practice areas.
Liquid Cooling & Thermal Engineering
Engineering heat exchange boundaries directly at high-density accelerator junctions, eliminating convective thermal resistance.
- Direct-to-chip liquid cooling
- Coolant distribution units
- Rack manifolds
- Facility water loops
- Heat exchangers and heat rejection
- Hybrid air and liquid cooling
- Thermal modelling (CFD)
- Cooling-system integration
- Detailed thermal schematics and loop sizing
- Hydraulic flow and pressure drop analysis
- CDU redundancy and piping manifold specifications
- Computational fluid dynamics (CFD) thermal reports
- Commissioning and leak-detection protocol documentation
AI Performance Measures
- Tokens per second
- Time to first token
- Latency under load
- Concurrent request capacity
- Energy per unit of output