Cooling & Thermal Engineering
Thermal engineering for liquid-cooled AI halls.
Direct-to-chip loops, CDUs, rack manifolds, facility water and CFD — engineered for accelerator heat loads.
Convective air cooling alone cannot serve dense AI racks. We engineer heat exchange at the chip, through the CDU and out to facility rejection, with modelling that proves the loops before build.
Direct-to-chip
Primary and secondary loops, CDU selection and manifold design for high-density racks.
Hybrid strategies
Air and liquid combinations where halls, timelines or platforms require a staged approach.
CFD validation
Thermal modelling that tests flow, pressure drop and failure cases before equipment is frozen.
How we engage
Scope and deliverables.
Typical scope
- Direct-to-chip liquid cooling
- Coolant distribution units
- Rack manifolds
- Facility water loops
- Heat exchangers and heat rejection
- Hybrid air and liquid cooling
- Thermal modelling (CFD)
- Cooling-system integration
Example deliverables
- Detailed thermal schematics and loop sizing
- Hydraulic flow and pressure drop analysis
- CDU redundancy and piping manifold specifications
- Computational fluid dynamics (CFD) thermal reports
- Commissioning and leak-detection protocol documentation